Samsung and IBM reach a major shift in processor design through technology that allows transistors to be stacked vertically

Within the first day of the IEDM conference in San Francisco, California, Samsung and IBM took advantage of the occasion to announce their discovery of a technology that allows vertical stacking of transistors in semiconductors and processing chips, which means a major shift in the industry.

The method of manufacturing processors depends on the horizontal arrangement of transistors on silicon plates, which means that the total number of transistors in each processor is adjacent to each other, and techniques must be found to help reduce the size of each transistor to make it accommodate the largest number without affecting its size when placed in devices However, that will be different with the new technology.

Samsung and IBM's technology, called Vertical Transport Field Effect Transistors (VTFET), will help the two companies manufacture semiconductors and electronic chips in a way that allows using the same space to provide multiple numbers of transistors together, significantly increasing efficiency by maintaining the same size.

According to the two companies, this technology in semiconductor design will help them quickly reach the stage of post-nanometer manufacturing accuracy, as well as help reduce waste resulting from semiconductor manufacturing processes, at the same time providing a double speed while consuming about less energy. 85% compared to FinFET processors.

IBM and Samsung go further in their talk by saying that this technology may help one day to use smartphones on only one charge per week.